SOLAR CELL SUBSTRATE PLATING APPARATUS USING BOTH LIGHT-INDUCED PLATING AND FORWARD BIAS PLATING

摘要

The present invention relates to a solar cell substrate plating apparatus using both light-induced plating and forward bias plating of a unifacial light-receiving type solar cell substrate or a bifacial light-receiving type solar cell substrate, as an object to be plated, and provides a solar cell substrate plating apparatus using both using light-induced plating and forward bias plating, comprising: a plating bath for accommodating a plating solution; a plurality of roller units separately arranged at predetermined intervals so as to horizontally move the substrate in a state in which one surface of the substrate is dipped into the plating solution; a first plating unit arranged between the roller units, and performing the light-induced plating by emitting light toward the substrate in a sealed state in the plating solution; and a second plating unit dipped into the plating solution so as to perform the forward bias plating on the substrate through an anode member arranged at the bottom of the first plating unit.