| 发明名称 |
LEVELERS FOR COPPER DEPOSITION IN MICROELECTRONICS |
| 摘要 |
A composition for electrolytic plating in microelectronics which contains a leveler that comprises the reaction product of an aliphatic di(t-amine) with an alkylating agent. Electrolytic plating methods employing the leveler, a method for making the leveler, and the leveler compound. |
| 申请公布号 |
WO2016042485(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
WO2015IB57097 |
申请日期 |
2015.09.15 |
| 申请人 |
ENTHONE INC. |
发明人 |
WHITTEN, KYLE;PANECCASIO, JR., VINCENT;RICHARDSON, THOMAS;ROUYA, ERIC |
| 分类号 |
H05K3/42;C25D3/38;C25D5/02 |
主分类号 |
H05K3/42 |
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