| 摘要 |
A substrate (2) of an optical sensor module (1) is provided with a cavity (5) for light emitting element, a cavity (6) for light receiving element, a wall surface part (7), an element containing hole (8) and the like. In the element containing hole (8), a light emitting element (9) is flip-chip mounted at the position of the cavity (5) for light emitting element and a light receiving element (10) is flip-chip mounted at the position of the cavity (6) for light receiving element. The element containing hole (8) is filled with a sealing material (11) that seals the light emitting element (9) and the light receiving element (10). An optical element (12) is provided on the front surface of the substrate (2) so as to cover the light emitting element (9) and the light receiving element (10). The wall surface part (7) is formed of a part of the substrate (2), and blocks light between the cavity (5) for light emitting element and the cavity (6) for light receiving element. |
