| 摘要 |
The present invention provides a device for placing a substrate of a substrate treating apparatus, comprising: a substrate placing unit having a substrate placing surface on which a substrate is placed; a plurality of supporting pin holes forming a path where a supporting pin moves, and formed by penetrating a substrate placing surface side of the substrate placing unit; a plurality of caps supported by the supporting pin to be elevated, opening the supporting pin hole when the supporting pin elevates, and configured to be placed in the supporting pin hole to close the supporting pin hole when descending of the supporting pin; and a fixing unit which fixes the cap onto a predetermined position and is provided around the supporting hole of the substrate placing unit. According to the present invention, when treating a substrate, a blank space of the supporting pin hole can be closed by the cap, thereby enabling to treat the entire substrate with a uniform temperature and reducing a failure rate by blocking entry of foreign substances. |
