发明名称 TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF SURFACE MOUNTED ELECTRICAL DEVICES
摘要 Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.
申请公布号 US2016087361(A1) 申请公布日期 2016.03.24
申请号 US201414491646 申请日期 2014.09.19
申请人 Intel Corporation 发明人 Summers Mark D.;Liu Kuang C.
分类号 H01R12/71;H01R13/22;H01L23/498;H01R12/70;B23K1/00;H05K3/34 主分类号 H01R12/71
代理机构 代理人
主权项 1. An electrical contact for use in an integrated circuit (IC) package assembly, the electrical contact comprising: a leg portion configured to extend in a first direction; a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint; a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape; and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion.
地址 Santa Clara CA US