发明名称 |
TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF SURFACE MOUNTED ELECTRICAL DEVICES |
摘要 |
Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed. |
申请公布号 |
US2016087361(A1) |
申请公布日期 |
2016.03.24 |
申请号 |
US201414491646 |
申请日期 |
2014.09.19 |
申请人 |
Intel Corporation |
发明人 |
Summers Mark D.;Liu Kuang C. |
分类号 |
H01R12/71;H01R13/22;H01L23/498;H01R12/70;B23K1/00;H05K3/34 |
主分类号 |
H01R12/71 |
代理机构 |
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代理人 |
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主权项 |
1. An electrical contact for use in an integrated circuit (IC) package assembly, the electrical contact comprising:
a leg portion configured to extend in a first direction; a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint; a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape; and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. |
地址 |
Santa Clara CA US |