发明名称 LAMINATE AND METHOD FOR MANUFACTURING FLEXIBLE DEVICE
摘要 The present invention provides a laminate which exhibits excellent adhesiveness between a heat resistant resin film having a flexible substrate layer and an inorganic substrate, and in which the flexible substrate layer can be separated from the inorganic substrate easily and in a short amount of time. A laminate 100 has an inorganic substrate 1 and a heat resistant resin film 2 formed on the inorganic substrate, and is characterized by the following: (1) the heat resistant resin film 2 has a flexible substrate layer 21 and a sacrificial layer 22 provided on an outer edge of the flexible substrate layer; (2) the adhesive strength between the flexible substrate layer 21 and the inorganic substrate 1 is 2 N/cm or less; (3) the adhesive strength between the sacrificial layer 22 and the inorganic substrate 1 is greater than 2 N/cm; and (4) the adhesive strength between the sacrificial layer 22 and the inorganic substrate 1 is made to be 2 N/cm or less by post-processing.
申请公布号 WO2016043180(A1) 申请公布日期 2016.03.24
申请号 WO2015JP76118 申请日期 2015.09.15
申请人 UNITIKA LTD. 发明人 SHIGETA, AKIRA;YOSHIDA, TAKESHI;YAMADA, YUKI;MORIKITA, TATSUYA;YAMADA, MUNENORI;HOSODA, MASAHIRO;ECHIGO, YOSHIAKI
分类号 B32B7/04;B32B27/34;G02F1/1333;H01L21/02;H01L27/12;H01L51/50;H05B33/02;H05B33/04;H05B33/10 主分类号 B32B7/04
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