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发明名称
積層焼結セラミック配線基板、及び当該配線基板を含む半導体パッケージ
摘要
申请公布号
JP5893975(B2)
申请公布日期
2016.03.23
申请号
JP20120064922
申请日期
2012.03.22
申请人
日本碍子株式会社
发明人
谷 信;田邊 大始;矢野 信介;平井 隆己
分类号
H01L23/13;H05K3/46
主分类号
H01L23/13
代理机构
代理人
主权项
地址
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