| 摘要 |
The present invention provides an epoxy resin composition, prepreg, laminate, and printed wiring board offering excellent drillability, through-hole-connection reliability, and heat resistance. The present invention pertains to an epoxy resin composition containing an epoxy resin, a curing agent having a phenolic hydroxyl group, and a filler. The epoxy resin composition contains, as the filler, 15-50 parts by mass of a glassy filler and 15-50 parts by mass of a metallic hydroxide relative to 100 parts by mass in total of the epoxy resin and curing agent. The glassy filler contains 53 percent by mass or more of SiO2, 13 percent by mass of Al2O3, and 75-80 percent by mass in total of SiO2 and Al2O3, the mean particle size being 0.5-10 mum. The metallic hydroxide has a thermal reduction at 400°C of 10 percent by mass or greater. |
