| 摘要 |
A semiconductor module (30) includes a copper connector (36a, 36b) jointing an electrode (S, G) formed on a top surface of a bear-chip transistor (35) and a wiring pattern (33b, 33c) out of plural wiring patterns (33a to 33d) via a solder (34b, 34c). The copper connector (36bb) includes an electrode-jointing portion (36bb) jointed to the electrode (G) of the bare-chip transistor (35) and a substrate-jointing portion (36bc) arranged to face the electrode-jointing portion (36bb) and jointed to the wiring pattern (33c). The width W1 of the electrode-jointing portion (36bb) in a direction perpendicular to one direction is smaller than the width W2 of the substrate-jointing potion (36bb) in the direction perpendicular to the one direction. |
