发明名称 POLYAMIDE RESIN
摘要 The present invention is a polyamide resin (A) that contains from 95 to 99.95% by mass of a polyamide (a-1) having a number-average molecular weight of 2000 or more and from 0.05 to 5% by mass of a polyamide oligomer (a-2) having a number-average molecular weight of from 500 to less than 2000, in which at least 25 mol% of all the monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are structural units derived from a specific alicyclic monomer, and the content ratio of the trans isomer structural units derived from the alicyclic monomer is from 50 to 85 mol%. The polyamide resin (A) is excellent in heat resistance, low water absorption, high-temperature rigidity, chemical resistance and flowability, and exhibits the effects of securing sufficient crystallization even when molded in a mold at 80°C and causing minimal mold deposit during production.
申请公布号 EP2896657(A4) 申请公布日期 2016.03.23
申请号 EP20130836455 申请日期 2013.09.06
申请人 KURARAY CO., LTD. 发明人 TAKEDA, HIDEAKI
分类号 C08L77/06;C08G69/26;C08K3/22 主分类号 C08L77/06
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