| 摘要 |
The present invention provides a (meth)acryloyl group-containing resin having excellent heat resistance and a phenolic hydroxyl group-containing compound used as a raw material of the resin. A phenolic hydroxyl group-containing compound has a molecular structure represented by general formula (1) below [in the formula, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms, m and n are each independently an integer of 1 to 4, p is an integer of 0 to 4, V is a hydrogen atom, a (meth)acryloyloxy group, or a hydroxyl group, and W, X, and Y are each independently a (meth)acryloyloxy group or a hydroxyl group], wherein at least one of V, W, X, and Y is a hydroxyl group, and at least one of V, W, X, and Y is a (meth)acryloyloxy group. |
