| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide constitution capable of relaxing a thermal stress between a chip and a wiring connection board, in an adhesive sheet having concurrently both a wafer fixing function and a die connecting function. <P>SOLUTION: The adhesive sheet is provided to exhibit concurrently and compatibly the wafer fixing function and the die connecting function, since having an adhesive layer usable as a die bonding agent on a radioactive polymerizable base material. The adhesive layer includes two kinds of resins, phase-separated in a B stage state, having a resin (A) forming a dispersed phase and a resin (B) forming a continuous phase in the B stage state, the resin (A) has 10,000 or less of weight-average molecular weight in an uncured state, and the resin (B) has 100,000 or more of weight-average molecular weight in an uncured state. <P>COPYRIGHT: (C)2013,JPO&INPIT |
