| 摘要 |
In a printed wiring board (2) of a printed circuit board, a region for mounting a first semiconductor package (4) is divided into a first region (9) on which first solder ball electrodes (7) are disposed and a second region (10) on which first solder ball electrodes are not disposed, and a region for mounting a second semiconductor package (6) on the back side of the first semiconductor package is located within a region on the back side of the second region. |
