| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be evenly pressurized at the time of molding and to which an insulation material is evenly attached. <P>SOLUTION: A semiconductor device comprises: a first unit 170 which includes a first semiconductor element 10 bonded to one surface of a first substrate 30, a first heat sink 70 bonded to another surface of the first substrate 30 via a first insulating material 50 and a plurality of terminals 90, 91, 92 of different types extending laterally, and which is molded; and a second unit 180 which includes a second semiconductor element 20 bonded to one surface of a second substrate 40, a second heat sink 80 bonded to another surface of the second substrate 40 via a second insulating material 60 and a plurality of terminals 100, 101, 102 of different types extending laterally, and which is molded. The first unit and the second unit are fixed so as to face each other. Among the plurality of terminals of different types, the terminals 90, 100 which are necessary to be connected to the first unit and the second unit are arranged so as to overlap each other, and the terminals unnecessary to be connected to the first unit and the second unit are arranged so as not to overlap each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
