| 摘要 |
[Object] To provide a flow path member, and a heat exchanger and a semiconductor manufacturing device using the flow path member, which are highly reliable. [Solution] There is provided a flow path member including: a first wall section 1; a second wall section 2; and a third wall section 3 that is provided between the first wall section 1 and the second wall section 2. An internal section that is configured by the first wall section 1, the second wall section 2, and the third wall section 3 becomes a flow path through which a fluid flows and a plurality of flow path openings 4 of the flow path are arranged in one direction on a cut plane obtained by cutting from the first wall section 1 to the second wall section 2. Since one of two adjacent flow path openings 4 is disposed to be more displaced than the other either toward the first wall section 1 side or toward the second wall section 2 side, it is possible to reduce stress concentration between corners of adjacent flow path openings, it is difficult to damage the flow path, and it is possible to achieve a flow path member 10 of which reliability is improved. |
