ENCAPSULATING LAYER OF ELECTRONIC DEVICE AND METHOD OF FORMING THE SAME

摘要

The present invention is to provide a technology on a flexible thin film type encapsulation to achieve large area and low costs in order to be applied to a large area electronic device and a flexible electronic device using a roll to roll (R2R) process. In forming an encapsulation layer of an electronic device, the present invention provides a method for forming the encapsulation layer for the electronic device, where an organic thin film and an oxide thin film are formed on the electronic device sequentially, and the oxide thin film is formed by coating an oxide precursor in a solution state and then hardening the same using UV.