| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency semiconductor device capable of effectively using a mounting substrate with an enlarged width for mounting a semiconductor chip. <P>SOLUTION: The high-frequency semiconductor device includes: a conductor base plate; a semiconductor chip of a multi-cell configuration disposed on the conductor base plate; metal walls disposed on the conductor base plate and forming a rectangular cavity for including the semiconductor chip therein; and a through hole disposed at the input/output portion of the metal walls. In the rectangular cavity including the semiconductor chip surrounded by the metallic wall, the longitudinal direction of the semiconductor chip is disposed with a predetermined angle larger than 0 degree and smaller than 90 degrees from the extension direction of a metal wall having no through hole. <P>COPYRIGHT: (C)2013,JPO&INPIT |
