发明名称 CORE AND PRINT CIRCUIT BOARD
摘要 The present invention relates to a printed circuit board. According to the present invention, the printed circuit board comprises: a core having an inclined pattern formed in a side surface; a first insulating layer stacked on the core; a second insulating layer stacked on the first insulating layer, and covering the side surface of the core; an inner circuit layer and an outer circuit layer formed on the first and second insulating layers respectively; and a solder resist layer stacked on the second insulating layer.
申请公布号 KR20160032076(A) 申请公布日期 2016.03.23
申请号 KR20160029445 申请日期 2016.03.11
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO, SUK HYEON;LEE, JOON SUNG;KO, YOUNG GWAN;OH, YOONG;LEE, YONG SAM;MIN, TAE HONG
分类号 H05K1/05;H05K3/42;H05K3/46 主分类号 H05K1/05
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