The present invention relates to a printed circuit board. According to the present invention, the printed circuit board comprises: a core having an inclined pattern formed in a side surface; a first insulating layer stacked on the core; a second insulating layer stacked on the first insulating layer, and covering the side surface of the core; an inner circuit layer and an outer circuit layer formed on the first and second insulating layers respectively; and a solder resist layer stacked on the second insulating layer.
申请公布号
KR20160032076(A)
申请公布日期
2016.03.23
申请号
KR20160029445
申请日期
2016.03.11
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
CHO, SUK HYEON;LEE, JOON SUNG;KO, YOUNG GWAN;OH, YOONG;LEE, YONG SAM;MIN, TAE HONG