发明名称 セラミック電子部品、及びセラミック電子部品の製造方法
摘要 A coil conductor and a via electrode placed away from the coil conductor are embedded in a magnetic layer. The magnetic layer is sandwiched between a pair of non-magnetic layers. The coil conductor and the via electrode are formed from a conductive material containing Cu as its main constituent, and the magnetic layer is formed from Ni—Mn—Zn ferrite where the CuO molar content is 5 mol % or less, and (x, y) falls within the range of A (25, 1), B (47, 1), C (47, 7.5), D (45, 7.5), E (45, 10), F (35, 10), G (35, 7.5), and H (25, 7.5) when the molar content x of Fe2O3 and the molar content y of Mn2O3 are represented by (x, y). Thus, insulation properties can be ensured, favorable electrical characteristics can be achieved, and a ceramic electronic component is achieved which is able to be reduced in size.
申请公布号 JP5892430(B2) 申请公布日期 2016.03.23
申请号 JP20130531363 申请日期 2012.08.29
申请人 株式会社村田製作所 发明人 岡田 佳子;山本 篤史;中村 彰宏
分类号 H01F17/04;C04B35/38;H01F1/34;H01F17/00;H01F27/29;H01F41/02;H01F41/04 主分类号 H01F17/04
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