发明名称 |
VERTICALLY STACKABLE SOCKETS FOR CHIP MODULES |
摘要 |
The socket system comprises a set of vertically-stackable sockets. A first socket mounts on a printed circuit board to receive a first chip module, and a second socket stacks on the first socket to receive a second chip module. The first socket includes a first set of embedded contacts to electrically connect the first chip module to the printed circuit board, and a second set of embedded contacts to electrically connect the second socket to the printed circuit board. The second socket includes a third set of embedded contacts to electrically connect the second chip module to the printed circuit board. System upgrades are enabled by replacing the chip modules. |
申请公布号 |
EP2457291(B1) |
申请公布日期 |
2016.03.23 |
申请号 |
EP20100701050 |
申请日期 |
2010.01.07 |
申请人 |
SONY ERICSSON MOBILE COMMUNICATIONS AB |
发明人 |
DEMUYNCK, RANDOLPH CARY;STORY, DAVID RYAN;MARCINKIEWICZ, WALTER |
分类号 |
H01L23/32;H01L23/552;H01L25/10;H05K7/02;H05K7/10 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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