| 摘要 |
The arrangement has a heat radiating component i.e. microchip (10), connected with a lower side of a multi-layered substrate (47) e.g. ceramic substrate, and with an upper side of the substrate by a thermal feedthrough (44). The component is cooled by the substrate using the feedthrough by a cooling element e.g. heat sink. A surface mounted device (13) is mounted on the upper side of the substrate. The feedthrough is connected to the cooling element by a distance piece. A ball grid array or a land grid array is arranged on a lower side of the arrangement. |
