Interconnection structure including blind via holes intended for being metallised

摘要

The structure (100) has a substrate (102) whose face (110) is integrated to a face (111) of another substrate (104). An electric contact (114) is arranged against the face of the latter substrate and next to a blind via (108) and/or against the face and/or another face (112) of the former substrate. A channel (116) provides communication of the via with an environment outside of the structure and/or with a cavity formed in the structure. The channel extends parallel to one of the faces of the substrates. An independent claim is also included for a method for realization of an interconnection structure.