METHOD FOR FABRICATING LIGHT EMITTING DIODE PACKAGE

摘要

Disclosed are an LED package and a method for fabricating the LED package. The LED package comprises a lead frame which has an LED mounting groove of which the upper side is opened, a light emitting diode (LED) which is mounted on the inner side of the LED mounting groove and is electrically connected to the lead frame, an encapsulant which is filled in the LED mounting groove and is hardened, and a phosphor film piece which improves the brightness of light emitted from the LED and is arranged on the upper side of the encapsulant to close the LED mounting groove. The encapsulant and the phosphor film piece are separated from each other. So, an air layer is formed between the encapsulant and the phosphor film piece.