| 摘要 |
The specification discloses a method for manufacturing a semiconductor package having an electromagnetic wave shielding film. The method for manufacturing a semiconductor package according to the present invention comprises: a tray preparation step in which a semiconductor package (50) is placed on an upper surface of an adhesive material (72) installed on a tray (70); a shielding film formation step in which a conductive film (40) is formed on a surface of the semiconductor package (50) and an exposed surface of the adhesive material (72); and a package separation step in which the semiconductor package (50) and the tray (70) are relatively moved with respect to each other, such that the semiconductor package (50) is moved on a region where the conductive film (40) is deposited on the adhesive material (72). According to the present invention, since a shielding film sputtering process is performed while the semiconductor package (50) is attached to the adhesive material (72), the electromagnetic wave shielding film can be formed on upper and side surfaces of the semiconductor package (50) in one step, and it is possible to prevent the adhesive material (72) from being introduced to a bottom surface of the semiconductor package (50), which reduces a defective product. Also, since the semiconductor package (50) can be easily removed from the adhesive material (72) by simply moving the semiconductor package (50) horizontally along the surface of the adhesive material (72), configuration of a manufacturing apparatus is simplified compared to a method using an eject pin, which reduces a manufacturing cost and simplifies maintenance. Also, overall productivity can be greatly enhanced. |
