| 摘要 |
A time-based change of plasma distribution is suppressed, and an object to be processed is evenly processed. An electrostatic chuck (11) which mounts a wafer, and a mounting table (2) including a focus ring (10) on an outer circumference surface of the electrostatic chuck (11) comprises a pressing member (12) which pressurizes the focus ring (10) for the electrostatic chuck (11), and a screw (52) which fixates the pressing member (12) on the electrostatic chuck (11). A coupling groove (10a) which is recessed toward a center direction of the focus ring (10) is formed all over the whole circumference of the outer side of the focus ring (10). A contact part (12a) of the pressing member (12) is coupled with the coupling groove (10a). A shading part (10b) which covers the contact part (12a) which does not see in a plane view is formed on the upper side of the outer circumference end of the focus ring (10). |
