| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which maintains the cooling performance. <P>SOLUTION: A semiconductor device includes: a semiconductor module 1; a cooler 2 provided on a surface of the semiconductor module 1 and cooling the semiconductor module 1; and a heat transmission member provided between the semiconductor module 1 and the cooler 2 and having heat conductivity. Recessed parts 161 are formed at least on one of a surface of the semiconductor module 1, which is located at the outer side of a region where the heat transmission member is provided and faces the cooler 2, and a surface of the cooler 2 which faces the semiconductor module 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
