ELECTRONIC COMPONENT, CONNECTION BODY, MANUFACTURING METHOD OF CONNECTION BODY, AND CONNECTION METHOD FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To improve connection reliability by cancelling a pressure difference caused by a thermal compression bond head even in an electronic component in which an input bump region and an output bump region have an area difference therebetween and are disposed asymmetrically.SOLUTION: An electronic component includes: a rectangular output bump region 4 in which a bump line is formed along a first side edge 2a; and a rectangular input bump region 6 in which a bump line is formed along a second side edge 2b confronting the first side edge 2a. A distance α of the output bump region 4 in a width direction is longer than a distance &bgr; of the input bump region 6 in a width direction (α>&bgr;). A bump region inter-outside midpoint (A+L2/2) between the outside of the output bump region 4 in the width direction and the outside of the input bump region 6 in the width direction is present to be closer to the second side edge 2b than an inter-side-edge midpoint (W/2) between the first side edge 2a and the second side edge 2b.SELECTED DRAWING: Figure 2