发明名称 CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive particle in which connection resistance can be reduced when electrodes are electrically connected each other.SOLUTION: Provided is a conductive particle comprising: a base material particle; a conductive part arranged on the surface of the base material particle; and a core substance arranged on the surface of the base material particle. The conductive part has a plurality of projections at the outer surface, the conductive part is arranged on the surface of the base material particle so as to cover the base material particle and the core substance, the core substance is arranged at the inside of the plurality of the projections, the ratio of the average height of the plurality of projections to the average diameter of the core substance is 1.5 or more, and the average diameter of the core substance is 1 to 50 nm.SELECTED DRAWING: Figure 1
申请公布号 JP2016039152(A) 申请公布日期 2016.03.22
申请号 JP20150157143 申请日期 2015.08.07
申请人 SEKISUI CHEM CO LTD 发明人 SASAHIRA MASAO;YAMAGIWA HITOSHI
分类号 H01B5/00;H01B1/00;H01B1/22;H01B5/16;H01R11/01 主分类号 H01B5/00
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