Chip package including a microphone structure and a method of manufacturing the same

摘要

In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material.

主权项

1. A method for manufacturing a chip package, the method comprising:
arranging a chip over a substrate, the chip comprising a microphone structure and an opening to the microphone structure; and forming a spacer structure on the chip, wherein the spacer structure is formed around the opening to the microphone structure; encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material, wherein during the chip encapsulation the spacer structure substantially prevents encapsulation material from entering the microphone structure.