MOLD APPARATUS FOR SEMICINDUCTOR

摘要

The present invention relates to a semiconductor mold device which comprises: an upper mold mounted on a substrate; a lower mold facing the substrate; and a film absorbed into an upper portion of the lower mold to mold a predetermined surface of an object for molding to be exposed in a molding area of the substrate. The lower mold comprises: a dam-bar block; a cavity block which is arranged in a central portion of the dam-bar block and can be elevated and reciprocate; at least one plunger block which is arranged inside the molding area and can slide with respect to the cavity block; and a clamp plate which supports the dam-bar block and has the plunger block penetrating a central portion thereof. A predetermined surface of an object for molding can be molded to be exposed in a predetermined molding area, or a penetration hole of the substrate and electronic components installed in the substrate can be insolated and protected from a resin.