| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of connecting a spring at an offset position and a pad of a pressure sensor that uses Microfused Silicon Strain gage (MSG) technology.SOLUTION: A small form factor MSG sensor 10 includes offset springs 40, 45, 50, 55. Each of the springs 40, 45, 50, 55 has an upper offset segment 60, 65, 70, 75, a center section 80, 85, 90, 95, and a lower offset segment 100, 105, 110, 115. These are positioned within an upper spring guide housing 15 and a lower spring guide housing 120.SELECTED DRAWING: Figure 1 |
