REACTIVE SPUTTERING APPARATUS

摘要

The present invention provides a reactive sputtering apparatus which can form a uniform thin film on a substrate. According to the present invention, the reactive sputtering apparatus includes: a substrate return unit returning a substrate; and a process chamber performing a reactive sputtering process by using a process gas for the substrate returned by the substrate return unit. The process chamber includes: two or more first cathode modules for depositing a first oxide thin film in a first region of the substrate returned by the substrate return unit; and one or more second cathode modules depositing a second oxide thin film in a second region except for a portion of the first region of the substrate returned by the substrate return unit.