| 摘要 |
PROBLEM TO BE SOLVED: To cool a semiconductor wafer covered with a resin or an adhesive tape with a simple configuration while suppressing generation of warpage.SOLUTION: A semiconductor wafer 1 in a heated state is placed on a heated holding table 5. The semiconductor wafer 1 is cooled by being separated and held above from the holding table 5. During the cooling process, the semiconductor wafer 1 is cooled while adjusting a temperature of the semiconductor wafer 1 that is cooled with radiation heat from the holding table 5, a rate at which the temperature of the semiconductor wafer 1 is reduced, and a cooling time.SELECTED DRAWING: Figure 5 |
