| 摘要 |
A member 10 for semiconductor manufacturing apparatuses, which includes an aluminum electrostatic chuck 12 and a cooling plate 14 bonded together with a thermosetting sheet 16, is provided. The thermosetting sheet 16 is made of a cured epoxy-acrylic adhesive. The adhesive contains (A) an epoxy resin capable of hydrogen transfer type polyaddition, (B) an acrylate or methacrylate polymer, and (C) a curing agent. |
