| 发明名称 | Scalable and modular approach for power electronic building block design in automotive applications | ||
| 摘要 | A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing. | ||
| 申请公布号 | US9295184(B2) | 申请公布日期 | 2016.03.22 |
| 申请号 | US201314094066 | 申请日期 | 2013.12.02 |
| 申请人 | GM GLOBAL TECHNOLOGY OPERATIONS LLC | 发明人 | Korich Mark D.;Grosu Vicentiu;Tang David;Smith Gregory S.;Triantos Konstantinos |
| 分类号 | H05K5/00;H05K7/00;H05K7/20;H05K7/14 | 主分类号 | H05K5/00 |
| 代理机构 | Ingrassia Fisher & Lorenz, P.C. | 代理人 | Ingrassia Fisher & Lorenz, P.C. |
| 主权项 | 1. A power electronic building block, comprising: a housing having a base and walls extending generally perpendicularly from the base, the walls including a first set of walls enclosing a first section on the base of the housing and a second set of walls enclosing a second section on the base of the housing, the first set of walls being laterally offset from the second set of walls on the base; a power module mounted on the base within the first section of the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted on the base within the second section of the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing. | ||
| 地址 | Detroit MI US | ||