Wiring board

摘要

A wiring board according to the present invention is provided with an insulating board and a connection pad, wherein the connection pad includes a main conductor layer formed of a low resistance material, a thin film resistor layer formed of a high resistance material and having a low soldering wettability, and a covering layer having a high soldering wettability, the main conductor layer, the thin film resistor layer, and the covering layer being sequentially laminated at the surface of the insulating layer in such a manner as to be electrically connected in series to each other, and the thin film resistor layer covers a main surface and a side surface of the main conductor layer, and further, a side surface of the thin film resistor layer is exposed from the covering layer.

主权项

1. A wiring board comprising:
an insulating board having an insulating layer at a surface thereof; and a connection pad formed at a surface of the insulating layer, wherein the connection pad includes
a main conductor layer formed of a low resistance material having a volume resistivity of 100 μΩ·cm or less,a thin film resistor layer formed of a high resistance material having a volume resistivity of 10 Ω·cm or more and having a low soldering wettability, anda covering layer having a high soldering wettability,the main conductor layer, the thin film resistor layer, and the covering layer being sequentially laminated at the surface of the insulating layer in such a manner as to be electrically connected in series to each other, and the thin film resistor layer covers a main surface and a side surface of the main conductor layer, and further, a side surface of the thin film resistor layer is exposed from the covering layer.