Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

摘要

Provided are a soldering device and method which allow for soldering at low cost with high yield and high reliability. To solve the above problems, the soldering device has: a first processing section that immerses workpiece member 10 having copper electrode 2 in organic fatty acid-containing solution, and horizontally move immersed workpiece member 10 in organic fatty acid-containing solution 31; a second processing section having ejection unit 33 to spray a jet stream of molten solder 5a to workpiece member 10 while pulling out workpiece member 10 processed in the first processing section to space section 24 that has a pressurized steam atmosphere and is provided above organic fatty acid-containing solution 31; a third processing section having ejection unit 34 to spray organic fatty acid-containing solution 31 to excess molten solder 5a on workpiece member 10 for removal while pulling down workpiece member 10 processed in the second processing section after horizontally moving in space section 24; and a fourth processing section that picks up workpiece member 10 processed in the third processing section by pulling out from organic fatty acid-containing solution 31 after horizontally moving in organic fatty acid-containing solution 31.

主权项

1. A soldering device, comprising:
a first processing section that immerses a workpiece member having a copper electrode in organic fatty acid-containing solution, and horizontally move the workpiece member in the organic fatty acid-containing solution; a second processing section having an ejection unit to spray a jet stream of a molten solder to the workpiece member while pulling out the workpiece member processed in the first processing section to a space section that has a pressurized steam atmosphere and is provided above the organic fatty acid-containing solution; a third processing section having an ejection unit to spray the organic fatty acid-containing solution to excess molten solder on the workpiece member for removal while pulling down the workpiece member processed in the second processing section after horizontally moving in the space section; a fourth processing section that picks up the workpiece member processed in the third processing section by pulling out from the organic fatty acid-containing solution after horizontally moving in the organic fatty acid-containing solution; a conveying unit move the workpiece member from the first processing section to the fourth processing section; a feeding portion into which the workpiece member is fed to the first processing section; and a discharge portion from which the workpiece member is discharged from the fourth section, wherein the first processing section to the fourth processing section are sealed except for the feeding portion and the discharge portion.