PACKAGE SUBSTRATE AND METHODS FOR FABRICATING THE SAME

摘要

The present invention provides a package substrate and a method for manufacturing the same. The method for manufacturing the package substrate includes the steps of: providing a core part having a first plane and a second plane opposite to the first plane; forming a plurality of cutting regions which are separated in a first direction in which the core part is extended, and penetrate at least part of the core part, by cutting the at least part of the core part along the thickness direction of the core part toward the second plane from the first plane; forming an insulation layer which covers the first and the second plane of the core part, and fills the cutting regions; and forming circuit patterns on the insulation layer.