| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component packaging material in which electronic components can be stored in and taken out from recesses provided in a substrate without peeling a sealing material from the substrate, an electronic component package in which the electronic components are stored in the electronic component packaging material, a manufacturing method of the electronic component package, and a method for taking out the electronic components from the electronic component package.SOLUTION: An electronic component packaging material 10 is used for packaging electronic components and is formed in a belt shape. The electronic component packaging material 10 comprises a carrier tape (a base material) 1 having recesses 12, which can store the electronic components, on a first surface (one surface) 15, and a cover tape (a sealing material) 20 for sealing the recesses 12 by bonding to the carrier tape 1 on the first surface 15 side. The cover tape (the sealing material) 20 comprises a slit 21 which is provided so as to correspond to the recesses 12 along a longitudinal direction, and through which the electronic components can be stored in and taken out from the recesses 12.SELECTED DRAWING: Figure 1 |
