| 摘要 |
<P>PROBLEM TO BE SOLVED: To significantly reduce stress acted on a hermetic seal part for hermetically sealing a lead pin to the package of a pressure sensor having a diaphragm structure for detecting changes in a pressure to be measured as changes in electrostatic capacitance. <P>SOLUTION: A pressure sensor 10 includes: a package 10 having a cylindrical housing 12 and a tabular cover 13 that is joined with the edge of the housing 12; a pressure detection sensor chip 30 for isolating a reference vacuum chamber 10B and a pressure introduction part 10A, which are formed in the package 10, from each other; a lead pin 41 that is electrically connected with the sensor chip 30 and is exposed outside of the package 10 via an insertion hole 13a of the cover 13; and hermetic seal parts 43 and 60 that are configured by sealing glass for hermetically sealing between the insertion hole 13a and lead pin 41. A thin wall part 13c for absorbing stress is formed by forming a recess 13b on the internal face of the cover 13. <P>COPYRIGHT: (C)2013,JPO&INPIT |
