| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition excellent in storage stability before being cured, and capable of attaining a high thermal conductivity after being cured. <P>SOLUTION: This resin composition includes an epoxy resin containing a polyfunctional epoxy resin, a curing agent containing a novolak resin having a structural unit represented by general formula (I), and an inorganic filler containing nitride particles, wherein the content of the inorganic filler is 50-85 vol%. In general formula (I), R<SP POS="POST">1</SP>represents hydrogen or methyl, l and m each represent 1-2, and n represents 1-15. <P>COPYRIGHT: (C)2013,JPO&INPIT |
