Device with pillar-shaped components

摘要

A device with pillar-shaped components, includes a substrate; a wiring layer disposed on the substrate; and pillar-shaped components disposed on any of the substrate and the wiring layer, each of the pillar-shaped components having a bottom part connected to the substrate and/or the wiring layer, a top part opposed to the bottom part, and a lateral face part extending from the bottom part and connected to the top part; wherein each of the pillar-shaped components includes a first pillar-shaped part formed by plating, a second pillar-shaped part formed on the first pillar-shaped part by plating, and a ring-like projection part formed on the lateral face part to project outward and extend in a circumferential direction, and to be in a position higher than a joint position between the first pillar-shaped part and the second pillar-shaped part.

主权项

1. A device with pillar-shaped post electrodes, comprising:
a substrate; a wiring layer disposed on the substrate; and the pillar-shaped post electrodes disposed on the wiring layer, each of the pillar-shaped post electrodes having a bottom surface connected to the wiring layer, a top surface opposed to the bottom surface, and a lateral face part extending from the bottom surface to the top surface to connect the bottom surface and the top surface, wherein each of the pillar-shaped post electrodes is an integrated pillar-shaped electrode which is a single-body structure electrode comprising directly-joined first and second pillar-shaped parts, and wherein the first pillar-shaped part is formed by plating, the second pillar-shaped part is formed on the first pillar-shaped part by plating, a lateral face of the first pillar-shaped part and a lateral face of the second pillar-shaped part form the lateral face part, the lateral face of the second pillar-shaped part including a ring-like projection part, the ring-like projection part extending in a circumferential direction of the lateral face of the second pillar-shaped part and projecting outward from the lateral part of the second pillar-shaped part, and a first area corresponding to the ring-like projection part on a surface of the substrate is within a second area corresponding to the wiring layer on the substrate, the first area being defined on the surface of the substrate when the ring-like projection part is viewed toward the substrate in a direction perpendicular to the surface of the substrate, the second area being defined on the surface of the substrate when the wiring layer is viewed toward the substrate in the direction perpendicular to the surface of the substrate.