Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device

摘要

A method of stacking a plurality of first dies to a respective plurality of second dies, each one of the first dies having a surface including a surface coupling region which is substantially flat, each one of the second dies having a respective surface including a respective surface coupling region which is substantially flat, the method comprising the steps of: forming, by means of a screen printing technique, an adhesive layer on the first dies at the respective surface coupling regions; and arranging the surface coupling region of each second die in direct physical contact with a respective adhesive layer of a respective first die among said plurality of first dies.

主权项

1. A method comprising:
stacking a plurality of first dies with a plurality of second dies, respectively, each one of the first dies having a first surface coupling region that is substantially flat, each one of the second dies having a second surface coupling region that is substantially flat, the stacking including: attaching said plurality of first dies on a support substrate in a spaced apart arrangement with spacings between neighboring first dies; arranging a screen mask on said plurality of first dies, the screen mask overlapping said first surface coupling regions of the first dies and said spacings between neighboring first dies, the screen mask having a plurality of uniformly distributed apertures, forming, using a screen printing technique, an adhesive layer at each of the first surface coupling regions of the first dice, by:
dispensing an adhesive paste on the screen mask; andmoving and pressing said adhesive paste on the screen mask causing the adhesive paste to pass through the apertures of the screen mask until the adhesive paste comes in direct contact with the respective first surface coupling regions of the plurality of first dies; and arranging the second surface coupling region of each second die in direct physical contact with a respective adhesive layer of the plurality of adhesive layers respectively, on said first dies.