发明名称 |
Heated capacitor and method of forming the heated capacitor |
摘要 |
A heated capacitor runs current through either a lower metal plate, an upper metal plate, a lower metal trace that lies adjacent to a lower metal plate, an upper metal trace that lies adjacent to an upper metal plate, or both a lower metal trace that lies adjacent to a lower metal plate and an upper metal trace that lies adjacent to an upper metal plate to generate heat from the resistance to remove moisture from a moisture-sensitive insulating layer. |
申请公布号 |
US9293254(B2) |
申请公布日期 |
2016.03.22 |
申请号 |
US201414288433 |
申请日期 |
2014.05.28 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Guo Honglin;Williams Byron Lovell |
分类号 |
H01L21/02;H01G2/08;H01G4/18;H01B3/30 |
主分类号 |
H01L21/02 |
代理机构 |
|
代理人 |
Garner Jacqueline J.;Cimino Frank D. |
主权项 |
1. A heated capacitor comprising:
a first pad; a second pad; a non-conductive layer; a first metal structure that touches the non-conductive layer; a second metal structure that touches the non-conductive layer, the second metal structure being connected to the first pad to receive a first voltage and the second pad to receive a second voltage, the first voltage and the second voltage being different, the difference between the first voltage and the second voltage to cause a current to flow into, through, and out of the second metal structure, the current to generate heat from a resistance of the second metal structure, the heat to remove moisture from the non-conductive layer; and a third metal structure that touches the non-conductive layer, the first metal structure lying directly above the third metal structure, the non-conductive layer lying between the first and third metal structures, the second metal structure lying laterally adjacent to the third metal structure. |
地址 |
Dallas TX US |