发明名称 Heated capacitor and method of forming the heated capacitor
摘要 A heated capacitor runs current through either a lower metal plate, an upper metal plate, a lower metal trace that lies adjacent to a lower metal plate, an upper metal trace that lies adjacent to an upper metal plate, or both a lower metal trace that lies adjacent to a lower metal plate and an upper metal trace that lies adjacent to an upper metal plate to generate heat from the resistance to remove moisture from a moisture-sensitive insulating layer.
申请公布号 US9293254(B2) 申请公布日期 2016.03.22
申请号 US201414288433 申请日期 2014.05.28
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 Guo Honglin;Williams Byron Lovell
分类号 H01L21/02;H01G2/08;H01G4/18;H01B3/30 主分类号 H01L21/02
代理机构 代理人 Garner Jacqueline J.;Cimino Frank D.
主权项 1. A heated capacitor comprising: a first pad; a second pad; a non-conductive layer; a first metal structure that touches the non-conductive layer; a second metal structure that touches the non-conductive layer, the second metal structure being connected to the first pad to receive a first voltage and the second pad to receive a second voltage, the first voltage and the second voltage being different, the difference between the first voltage and the second voltage to cause a current to flow into, through, and out of the second metal structure, the current to generate heat from a resistance of the second metal structure, the heat to remove moisture from the non-conductive layer; and a third metal structure that touches the non-conductive layer, the first metal structure lying directly above the third metal structure, the non-conductive layer lying between the first and third metal structures, the second metal structure lying laterally adjacent to the third metal structure.
地址 Dallas TX US