| 发明名称 |
Aqueous solution and process for removing substances from substrates |
| 摘要 |
The disclosure is directed solutions and processes to remove substances from substrates. In some cases, the substances can include photoresist on semiconductor wafers. The solution can include hydrogen peroxide in an amount that is no greater than 15% by weight of the total weight of the solution. The solution can also include a quaternary ammonium hydroxide and water. Further, the solution can include an amine, a co-solvent, or both. One or more sides of the substrate can be contacted with the solution to remove one or more substances from the solution. |
| 申请公布号 |
US9291910(B2) |
申请公布日期 |
2016.03.22 |
| 申请号 |
US201314038877 |
申请日期 |
2013.09.27 |
| 申请人 |
Dynaloy, LLC |
发明人 |
Peters Richard Dalton;Acra Travis W.;Cao Yuanmei;Gilbert Nichelle Maria;Phenis Michael Tod;Pollard Kimberly Dona;Cummins Joshua;Guo Meng;Pfettscher Donald James |
| 分类号 |
G03F7/42;C11D11/00 |
主分类号 |
G03F7/42 |
| 代理机构 |
|
代理人 |
Smith Matthew W.;Carmen Dennis V. |
| 主权项 |
1. A solution comprising:
a quaternary ammonium hydroxide present in an amount from about 2% by weight to about 5% by weight of a total weight of the solution; hydrogen peroxide present in an amount of at least about 3% by weight to no greater than about 8% by weight of the total weight of the solution; water; an amine present in an amount from about 2% by weight to about 6% by weight of the total weight of the solution; and a co-solvent present in an amount from about 1% by weight to about 10% by weight of the total weight of the solution. |
| 地址 |
Kingsport TN US |
