发明名称 INSULATING RESIN SHEET, AND CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE THAT USE THE INSULATING RESIN SHEET
摘要 PROBLEM TO BE SOLVED: To provide an insulating resin sheet that has a high-level of laser workability in addition to handleability and high heat resistance.SOLUTION: In an insulating resin sheet having an insulation layer, the insulation layer has two or more epoxy groups per molecule, and contains solid epoxy resin and liquid epoxy resin. The absorption coefficient of resin composition hardened material is 300 cmor more at at least 355 nm.SELECTED DRAWING: Figure 1
申请公布号 JP2016037545(A) 申请公布日期 2016.03.22
申请号 JP20140161229 申请日期 2014.08.07
申请人 PANASONIC IP MANAGEMENT CORP 发明人 KASHIWABARA KEIKO;TAKASHITA HIROMITSU;TAKEDA TAKESHI;YOSHIOKA SHINGO
分类号 C08G59/22 主分类号 C08G59/22
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