LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide: a light-emitting device which enables highly reliable mounting by reducing an extrusion amount of fused solder in mounting; and a method for manufacturing such a light-emitting device.SOLUTION: A light-emitting device 100 comprises: a semiconductor light-emitting element 1 including a semiconductor laminate 12, and an n-side electrode 13 and a p-side electrode 15 provided on one face of the semiconductor laminate; and a resin member 21 provided on the side of the one face of the semiconductor laminate 12. The resin member 21 has metal layers 31n and 31p electrically connected to the n-side electrode 13 and the p-side electrode 15 therein, and a concave portion 21c in its upper surface. The metal layers 31n and 31p have upper portions protruding from the upper surface of the resin member 21; the upper surface of each upper portion makes a mount face for connection to the outside. The upper portion of each of the metal layers 31n and 31p is provided so as to at least partially surround the concave portion 21c in plan view.SELECTED DRAWING: Figure 1