| 摘要 |
PROBLEM TO BE SOLVED: To improve inspection accuracy of a circuit pattern.SOLUTION: In a pattern inspection device, firstly an inspection map is prepared (step S11). An inspection condition is associated with a plurality of inspection positions individually in the inspection map. The inspection condition is acquired from an image of a circuit pattern which is actually formed. If a circuit pattern image to be an inspection object is acquired by an imaging section (step S12), the circuit pattern image and a design pattern are aligned (step S13). A pixel specification section specifies an inspection position pixel in the circuit pattern image corresponding to the inspection position (step S14), and a line width acquisition section acquires a line width of the circuit pattern of the inspection position pixel (step S15). An inspection section acquires an inspection result on the line width while referring to the inspection condition corresponding to the inspection map (step S16). In the pattern inspection device, an inspection condition is set for every inspection position, so that inspection accuracy is improved.SELECTED DRAWING: Figure 4 |
