发明名称 Method of forming electric wiring using inkjet printing and inkjet printing apparatus
摘要 A method of forming an electric wiring includes forming a trench on a substrate and ejecting first ink and second ink into the trench. The second ink contains a conductive material. The method includes heating the substrate to sinter the second ink such that a tunnel is formed in a lower portion of the trench by evaporation of the first ink, and the conductive material forms the electric wiring in an upper portion of the trench.
申请公布号 US9295161(B2) 申请公布日期 2016.03.22
申请号 US201313890360 申请日期 2013.05.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Jin Yong-wan;Kim Joong-hyuk;Hong Young-ki
分类号 H05K3/00;H05K3/12 主分类号 H05K3/00
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A method of forming an electric wiring, the method comprising: forming a trench on a substrate; ejecting first ink and second ink into the trench, the first ink containing a first solvent and the second ink containing a conductive material and a second solvent; and heating the substrate to sinter the second ink such that, a tunnel is formed in a lower portion of the trench by evaporation of the first ink, and the conductive material forms the electric wiring in an upper portion of the trench, andwherein the first solvent of the first ink is immiscible with the second solvent of the second ink, andwherein the ejecting of the first ink and the second ink comprises ejecting the first ink in the trench, and ejecting the second ink on the first ink.
地址 Gyeonggi-Do KR
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