Support for an optoelectronic semiconductor chip, and semiconductor chip

摘要

A support for an optoelectronic semiconductor chip includes a support body with a first main face and a second main face opposite the first main face, at least one electrical plated-through hole extending from the first main face to the second main face and formed in the support body, and an insulating layer arranged on the first main face, the insulation layer covering the electrical plated-through hole only in regions.

主权项

1. A support for an optoelectronic semiconductor chip comprising:
a support body having a first main face and a second main face opposite the first main face, at least one electrical plated-through hole extending from the first main face to the second main face and formed in the support body; an insulation layer arranged on the first main face, said insulation layer partially covering the electrical plated-through hole; a connection area formed on a side of the insulation layer facing away from the support body, said connection area being electrically conductively connected to the plated-through hole; the support has a further plated-through hole electrically conductively connected to a further contact area on the second main face of the support body and to a further connection area on that side of the insulation layer facing away from the support body; and the further connection area covers the plated-through hole in regions, completely surrounds the connection area in a plan view of the support and is electrically insulated from the connection area and from the plated-through hole.